Method for preparing flexible microelectrode circuit by large-area laser direct writing

The invention discloses a method for preparing a flexible microelectrode circuit by large-area laser direct writing, and belongs to the technical field of microelectronics. The method comprises the following steps: selecting a substrate and preprocessing the substrate; preparing a copper film on the pre-processed substrate; using mapping software to design a required microelectrode circuit diagram; and finally, using laser to directly prepare the designed microelectrode circuit diagram on the prepared copper film. The method for preparing the flexible microelectrode circuit by the large-area laser direct writing provided by the invention is based on a laser direct writing technology, and the provided method is simple and easy to operate, and has no pollution; the prepared film has uniformthickness, smooth and flat surface and good reliability; and a large-area micron-scale interconnected conduction line with the controllable thickness and size can be prepared, and the method can be used for circuit writing an