PROCESS FOR SURFACE-COATING A COMPONENT UNDER VACUUM

Process for surface-coating a component (1) under vacuum by means of a vacuum coating plant (100), wherein the process comprises at least two of the following process steps: a) plasma activation of the surface of the component (1) to be coated in an evacuated plasma activation chamber (10) and/or b)...

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Bibliographische Detailangaben
Hauptverfasser:	RATH EGBERT, EICKENBUSCH MARTIN, HARTMANN FRANK, ROCHOTZKI RALF
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
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Beschreibung
Zusammenfassung:	Process for surface-coating a component (1) under vacuum by means of a vacuum coating plant (100), wherein the process comprises at least two of the following process steps: a) plasma activation of the surface of the component (1) to be coated in an evacuated plasma activation chamber (10) and/or b) application of the coating in an evacuated coating chamber (11) and/or c) plasma polymerization togenerate a protective layer on the applied coating in an evacuated plasma polymerization chamber (12). According to the invention the plasma activation chamber (10) and/or the coating chamber (11) and/or the plasma polymerization chamber (12) are vented and opened between at least two of said process steps and the component (1) is sent to the subsequent process step. 用于利用真空施设层装置(100)在真空下对构件(1)进行表面施设层的方法，该方法包括下列工艺步骤中的至少两个工艺步骤：a)在抽成真空的等离子活化腔(10)中对构件(1)的需施设层的表面进行等离子活化，和/或b)在抽成真空的施设层腔(11)中施设层，和/或c)为了在所施设的层上产生保护层在抽成真空的等离子体聚合腔(12)中进行等离子体聚合。根据本发明，在所述工艺步骤中的至少两个工艺步骤之间将等离子活化腔(10)和/或施设层腔(11)和/或等离子体聚合腔(12)通风和打开，并且将构件(1)输送给后续的工艺步骤