Heat treatment equipment and heat treatment method thereof

The invention discloses a heat treatment device and a heat treatment method thereof, and the equipment comprises a heat treatment chamber, a heat treatment lamp, a wafer substrate for placing a wafer,and also comprises a light shielding plate disposed in the heat treatment chamber, and a light shiel...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: ZHOU YING, NI MINGMING, HONG JILUN, QIU YUHANG, WU ZONGYOU, LIN ZONGXIAN
Format: Patent
Sprache:chi ; eng
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:The invention discloses a heat treatment device and a heat treatment method thereof, and the equipment comprises a heat treatment chamber, a heat treatment lamp, a wafer substrate for placing a wafer,and also comprises a light shielding plate disposed in the heat treatment chamber, and a light shielding plate control part coupled to the light shielding plate, wherein the light shielding plate control part drives the light shielding plate to move to a predetermined isolation position so as to block heat radiation of the heat treatment lamp to the wafer, or to move the visor to leave the predetermined isolation location so as to enable the wafer to receive thermal radiation from the heat treatment lamp, and the predetermined isolation location is located between the heat treatment lamp andthe wafer substrate. According to the scheme of the invention, the equipment can achieve the more precise control of the radiation dosage of thermal radiation received by the wafer from the thermal treatment lamp, thereby impr