Double-component high-hardness and high-temperature-resistance organic silicon pouring sealant and manufacturing method thereof

The invention discloses a double-component high-hardness and high-temperature-resistance organic silicon pouring sealant and a manufacturing method thereof. The double-component high-hardness and high-temperature-resistance organic silicon pouring sealant can be applied to indoor and outdoor electro...

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Bibliographische Detailangaben
Hauptverfasser:	LI XIANGYONG, TANG CHUAN, BIE BO
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS DYES METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL ORGANIC MACROMOLECULAR COMPOUNDS PAINTS POLISHES THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS USE OF MATERIALS AS ADHESIVES
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