Double-component high-hardness and high-temperature-resistance organic silicon pouring sealant and manufacturing method thereof
The invention discloses a double-component high-hardness and high-temperature-resistance organic silicon pouring sealant and a manufacturing method thereof. The double-component high-hardness and high-temperature-resistance organic silicon pouring sealant can be applied to indoor and outdoor electro...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | The invention discloses a double-component high-hardness and high-temperature-resistance organic silicon pouring sealant and a manufacturing method thereof. The double-component high-hardness and high-temperature-resistance organic silicon pouring sealant can be applied to indoor and outdoor electronic devices and encapsulation needing to resist a high-impact environment and can improve the heat conduction performance, the conductivity and the flame retardancy according to environmental demands. Base rubber is prepared from 107 silicone rubber and alpha-cyanoacrylate adhesive; a crosslinking agent adopts epoxy trimethoxysilane; a heat conduction material is mainly prepared from aluminum oxide; a flame retardant material adopts aluminum hydroxide; a conductive material is prepared from aluminum silver powder and copper powder; a plasticizer adopts MDT silicone oil; a catalyst adopts dibutyltin dilaurate. During use of the double-component high-hardness and high-temperature-resistance organic silicon pouring se |
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