Solder unit, wire processing device therewith, and wire processing method

The invention provides a solder unit, a wire processing device therewith, and a wire processing method. The device and method enable the end pars of a coated wire to be perfectly attached to the solder while inhibiting the flying of solder in a time period which is short as much as possible. A clamping part (76a) clamps an opposite side of an exposed core wire part (12) of the coated wire (12), thereby enabling the clamping part (76a) to rotate towards a solder groove which is located in front of the clamping part (76a) and below the clamping part (76a) while the accelerating of the clamping part (76a). After the accelerating, the clamping part (76a) rotates towards the solder groove while the decelerating of the clamping part (76a), thereby enabling the clamping part (76a) not to accelerate but to further reduce the deceleration at a deceleration change point. The end parts of the coated wire (12) to be soaked in the solder (14) of the solder groove. After the exposed core wire part (12) is soaked in the sol