Low-cost achieving method of high-speed high-density heating back plate
The invention provides a low-cost achieving method of a high-speed high-density heating back plate. The back plate comprises high-speed signal back plated and high-voltage power supply back plated Inthe achieving way, by overlapping the high-speed signal back plates and the high-voltage power supply...
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creator | HOU SHAOZHENG |
description | The invention provides a low-cost achieving method of a high-speed high-density heating back plate. The back plate comprises high-speed signal back plated and high-voltage power supply back plated Inthe achieving way, by overlapping the high-speed signal back plates and the high-voltage power supply back plate, the high-speed signal plates are in charge of transmission of high-speed signals and the power supply back plates are in charge of high-voltage power supply. According to the invention, by separating the power supply back plates and the high-speed signal back plates, problems are solved that the insertion loss of high-speed links of the back plates is increased, the existence of the high-voltage power supply will cause increasing of the quantity of layers of the back plates, and the cost of the back plates is increased; and the system cost is reduced.
本发明提供了种高速、高密、高热背板的低成本实现方式,所述的背板包括高速信号背板和高压供电背板,所述的实现方式通过高速信号背板和高压供电背板叠放,形成信号背板负责传输高速信号;供电背板负责高压供电,本发明通过将供电背板和高速信号背板分离的方式,解决了背板高速链路插损增大、高压供电的存在会导致背板层数增多、背 |
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fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_CN108551011A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>CN108551011A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_CN108551011A3</originalsourceid><addsrcrecordid>eNrjZHD3yS_XTc4vLlFITM7ITC3LzEtXyE0tychPUchPU8jITM_QLS5ITU2BMFNS84ozSyoVMlITS0AqkxKTsxUKchJLUnkYWNMSc4pTeaE0N4Oim2uIs4duakF-fGpxQWJyal5qSbyzn6GBhampoYGhoaMxMWoAMRIzaA</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Low-cost achieving method of high-speed high-density heating back plate</title><source>esp@cenet</source><creator>HOU SHAOZHENG</creator><creatorcontrib>HOU SHAOZHENG</creatorcontrib><description>The invention provides a low-cost achieving method of a high-speed high-density heating back plate. The back plate comprises high-speed signal back plated and high-voltage power supply back plated Inthe achieving way, by overlapping the high-speed signal back plates and the high-voltage power supply back plate, the high-speed signal plates are in charge of transmission of high-speed signals and the power supply back plates are in charge of high-voltage power supply. According to the invention, by separating the power supply back plates and the high-speed signal back plates, problems are solved that the insertion loss of high-speed links of the back plates is increased, the existence of the high-voltage power supply will cause increasing of the quantity of layers of the back plates, and the cost of the back plates is increased; and the system cost is reduced.
本发明提供了种高速、高密、高热背板的低成本实现方式,所述的背板包括高速信号背板和高压供电背板,所述的实现方式通过高速信号背板和高压供电背板叠放,形成信号背板负责传输高速信号;供电背板负责高压供电,本发明通过将供电背板和高速信号背板分离的方式,解决了背板高速链路插损增大、高压供电的存在会导致背板层数增多、背</description><language>chi ; eng</language><subject>BASIC ELECTRIC ELEMENTS ; CURRENT COLLECTORS ; ELECTRICITY ; LINE CONNECTORS</subject><creationdate>2018</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20180918&DB=EPODOC&CC=CN&NR=108551011A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76290</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20180918&DB=EPODOC&CC=CN&NR=108551011A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>HOU SHAOZHENG</creatorcontrib><title>Low-cost achieving method of high-speed high-density heating back plate</title><description>The invention provides a low-cost achieving method of a high-speed high-density heating back plate. The back plate comprises high-speed signal back plated and high-voltage power supply back plated Inthe achieving way, by overlapping the high-speed signal back plates and the high-voltage power supply back plate, the high-speed signal plates are in charge of transmission of high-speed signals and the power supply back plates are in charge of high-voltage power supply. According to the invention, by separating the power supply back plates and the high-speed signal back plates, problems are solved that the insertion loss of high-speed links of the back plates is increased, the existence of the high-voltage power supply will cause increasing of the quantity of layers of the back plates, and the cost of the back plates is increased; and the system cost is reduced.
本发明提供了种高速、高密、高热背板的低成本实现方式,所述的背板包括高速信号背板和高压供电背板,所述的实现方式通过高速信号背板和高压供电背板叠放,形成信号背板负责传输高速信号;供电背板负责高压供电,本发明通过将供电背板和高速信号背板分离的方式,解决了背板高速链路插损增大、高压供电的存在会导致背板层数增多、背</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CURRENT COLLECTORS</subject><subject>ELECTRICITY</subject><subject>LINE CONNECTORS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2018</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZHD3yS_XTc4vLlFITM7ITC3LzEtXyE0tychPUchPU8jITM_QLS5ITU2BMFNS84ozSyoVMlITS0AqkxKTsxUKchJLUnkYWNMSc4pTeaE0N4Oim2uIs4duakF-fGpxQWJyal5qSbyzn6GBhampoYGhoaMxMWoAMRIzaA</recordid><startdate>20180918</startdate><enddate>20180918</enddate><creator>HOU SHAOZHENG</creator><scope>EVB</scope></search><sort><creationdate>20180918</creationdate><title>Low-cost achieving method of high-speed high-density heating back plate</title><author>HOU SHAOZHENG</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN108551011A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2018</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CURRENT COLLECTORS</topic><topic>ELECTRICITY</topic><topic>LINE CONNECTORS</topic><toplevel>online_resources</toplevel><creatorcontrib>HOU SHAOZHENG</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>HOU SHAOZHENG</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Low-cost achieving method of high-speed high-density heating back plate</title><date>2018-09-18</date><risdate>2018</risdate><abstract>The invention provides a low-cost achieving method of a high-speed high-density heating back plate. The back plate comprises high-speed signal back plated and high-voltage power supply back plated Inthe achieving way, by overlapping the high-speed signal back plates and the high-voltage power supply back plate, the high-speed signal plates are in charge of transmission of high-speed signals and the power supply back plates are in charge of high-voltage power supply. According to the invention, by separating the power supply back plates and the high-speed signal back plates, problems are solved that the insertion loss of high-speed links of the back plates is increased, the existence of the high-voltage power supply will cause increasing of the quantity of layers of the back plates, and the cost of the back plates is increased; and the system cost is reduced.
本发明提供了种高速、高密、高热背板的低成本实现方式,所述的背板包括高速信号背板和高压供电背板,所述的实现方式通过高速信号背板和高压供电背板叠放,形成信号背板负责传输高速信号;供电背板负责高压供电,本发明通过将供电背板和高速信号背板分离的方式,解决了背板高速链路插损增大、高压供电的存在会导致背板层数增多、背</abstract><oa>free_for_read</oa></addata></record> |
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subjects | BASIC ELECTRIC ELEMENTS CURRENT COLLECTORS ELECTRICITY LINE CONNECTORS |
title | Low-cost achieving method of high-speed high-density heating back plate |
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