Low-cost achieving method of high-speed high-density heating back plate

The invention provides a low-cost achieving method of a high-speed high-density heating back plate. The back plate comprises high-speed signal back plated and high-voltage power supply back plated Inthe achieving way, by overlapping the high-speed signal back plates and the high-voltage power supply...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
1. Verfasser: HOU SHAOZHENG
Format: Patent
Sprache:chi ; eng
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:The invention provides a low-cost achieving method of a high-speed high-density heating back plate. The back plate comprises high-speed signal back plated and high-voltage power supply back plated Inthe achieving way, by overlapping the high-speed signal back plates and the high-voltage power supply back plate, the high-speed signal plates are in charge of transmission of high-speed signals and the power supply back plates are in charge of high-voltage power supply. According to the invention, by separating the power supply back plates and the high-speed signal back plates, problems are solved that the insertion loss of high-speed links of the back plates is increased, the existence of the high-voltage power supply will cause increasing of the quantity of layers of the back plates, and the cost of the back plates is increased; and the system cost is reduced. 本发明提供了种高速、高密、高热背板的低成本实现方式,所述的背板包括高速信号背板和高压供电背板,所述的实现方式通过高速信号背板和高压供电背板叠放,形成信号背板负责传输高速信号;供电背板负责高压供电,本发明通过将供电背板和高速信号背板分离的方式,解决了背板高速链路插损增大、高压供电的存在会导致背板层数增多、背