Semiconductor package, semiconductor package subassembly, and method of manufacturing semiconductor package

A semiconductor package, a semiconductor package subassembly and a method of manufacturing the semiconductor package are disclosed. The semiconductor package that includes EMI shielding and a fabricating method thereof are disclosed. In one embodiment, the fabricating method of a semiconductor package includes forming a substrate, attaching semiconductor devices to a top portion of the substrate,encapsulating the semiconductor devices using an encapsulant, forming a trench in the encapsulant, and forming a shielding layer on a surface of the encapsulant. 半导体封装、半导体封装组件以及制造半导体封装的方法。本发明揭示种具有EMI屏蔽功能的半导体封装以及其制造方法。在实施例中，半导体封装的制造方法包括：形成基板；将半导体装置附接至基板的顶部；使用囊封物囊封半导体装置；在囊封物中形成沟槽；以及在囊封物的表面上形成屏蔽层。