High-heat-resistant high-heat-conduction voltage-resistant flexible aluminum-based copper-clad plate making method

The invention discloses a high-heat-resistant high-heat-conduction voltage-resistant flexible aluminum-based copper-clad plate, and relates to the technical field of metal-based copper-clad plates. Bymeans of the key technologies of high heat resistance, high heat conduction, voltage resistance and flexibility, an aluminum base plate, a heat-conduction dielectric layer and a copper foil layer aresubjected to hot press bonding. An O-state aluminum plate is cleaned, subjected to electrochemical treatment and then dried to obtain the aluminum base plate, 1 part by weight of polyetherimide resinpowder, 1-2 parts by weight of aluminium oxide powder and 0.1-1.2 parts by weight of boron nitride are mixed to be uniform, extruded through an extruding machine at 470+/-50 DEG C and then subjectedto rolling at 250+/-50 DEG C to obtain a high-heat-resistant polyetherimide thin film with the thickness being 70-200 micrometers, the high-heat-resistant polyetherimide thin film serves as the heat-conduction dielectric layer,