Symmetrical double-moving-platform pressure applying mechanism of horizontal platen die-cutting machine

The invention discloses a symmetrical double-moving-platform pressure applying mechanism of a horizontal platen die-cutting machine. The symmetrical double-moving-platform pressure applying mechanismcomprises a crankshaft, a left connecting rod hinged to the left end of the crankshaft is hinged to a...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: ZHAO SHENGDUN, WANG YONGFEI, WU FAN, FAN SHUQIN, ZHANG MIMI, ZHU SHUMIAO
Format: Patent
Sprache:chi ; eng
Schlagworte:
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