Symmetrical double-moving-platform pressure applying mechanism of horizontal platen die-cutting machine
The invention discloses a symmetrical double-moving-platform pressure applying mechanism of a horizontal platen die-cutting machine. The symmetrical double-moving-platform pressure applying mechanismcomprises a crankshaft, a left connecting rod hinged to the left end of the crankshaft is hinged to a...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | The invention discloses a symmetrical double-moving-platform pressure applying mechanism of a horizontal platen die-cutting machine. The symmetrical double-moving-platform pressure applying mechanismcomprises a crankshaft, a left connecting rod hinged to the left end of the crankshaft is hinged to an upper left toggle rod and a lower left toggle rod, and a right connecting rod hinged to the rightend of the crankshaft is hinged to an upper right toggle rod and a lower right toggle rod; the upper left toggle rod and the upper right toggle rod are hinged to an upper moving platform, the upper moving platform is installed on a vertical guide rail of a machine body, and an upper static platform fixed on the machine body cooperates with the upper moving platform; the lower left toggle rod andthe lower right toggle rod are hinged to the lower moving platform, the lower moving platform is installed on the vertical guide rail of the machine body, and a lower static platform fixed on the machine body cooperates with th |
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