Photosensitive resin composition, dry film, cured product, and printed wiring board

Provided are a photosensitive resin composition having excellent resolution, a dry film having a resin layer obtained from the composition, a cured product of the composition or the resin layer of thedry film, and a printed wiring board having the cured product. The photosensitive resin composition contains (A) a polyamic acid ester and (B) a photobase generator, the photosensitive resin composition, etc. being characterized in that the (A) a polyamic acid ester has a structure represented by general formula (1). (In formula (1), R1 is a tetravalent organic group; R2 is either a group havingan alicyclic skeleton, a phenylene group, a group having a bisphenylene skeleton bonded with an alkylene group, or an alkylene group; X is a bivalent organic group; R3 and R4 may be the same or different from each other and are each either a monovalent organic group or a functional group having silicon; m is an integer of 1 or greater; and n is 0 or an integer of 1 or greater.) 提供：分辨率优异的感光性树脂组合物、具有由该组合物得到的树脂层的干膜、该组合物或该干膜的树