METHOD FOR PRODUCING MULTILAYER MEMS COMPONENT, AND CORRESPONDING MULTILAYER MEMS COMPONENT

The invention provides a method for producing a multilayer MEMS component, and a corresponding multilayer MEMS component. The method comprises the following steps: providing a multilayer substrate (1,2, 3; 1a, 2, 3) having a monocrystalline carrier layer (1; 1a), a monocrystalline functional layer (3) having a front side (V) and a rear side (R), and a bonding layer (2) situated between the rear side (R) and the carrier layer (1); growing a first polycrystalline layer (4; 4a; 4b) over the front side (V) of the monocrystalline functional layer (3); removing the monocrystalline carrier layer (1;1a); and growing a second polycrystalline layer (40; 40a; 40b) over the rear side (R) of the monocrystalline functional layer (3). 本发明实现种用于制造多层MEMS构件的方法和种相应的多层MEMS构件。所述方法包括以下步骤：提供多层衬底(12、3；1a、2、3)，该多层衬底具有单晶载体层(1；1a)、带有正面(V)和背面(R)的单晶功能层(3)和位于背面(R)与载体层(1)之间的键合层(2)；使第多晶层(4；4a；4b)在所述单晶功能层(3)的所述正面(V)上生长；去除所述单晶载体层(1；1a)；并且使第二多晶层(40；40a；40b)在所述单晶功能层(3)的所述背面(R)上生长。