Semiconductor Device, Method for Fabricating a Semiconductor Device and Method for Reinforcing a Die in a Semiconductor Device
The invention provides a semiconductor device, a method for fabricating a semiconductor device and a method for reinforcing a die in a semiconductor device. The semiconductor device includes a semiconductor die having a first main face, a second main face and side faces connecting the first main fac...
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Format: | Patent |
Sprache: | chi ; eng |
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