Semiconductor Device, Method for Fabricating a Semiconductor Device and Method for Reinforcing a Die in a Semiconductor Device

The invention provides a semiconductor device, a method for fabricating a semiconductor device and a method for reinforcing a die in a semiconductor device. The semiconductor device includes a semiconductor die having a first main face, a second main face and side faces connecting the first main face and the second main face. The semiconductor device also includes a conductive column arranged on the first main face of the semiconductor die and electrically coupled to the semiconductor die, and an insulating body arranged on the first main face of the semiconductor die. The insulating body hasan upper main face and side faces. At least one conductive column is exposed on the upper main face of the insulating body. The side faces of the semiconductor die and the side faces of the insulatingbody are coplanar. 本发明涉及半导体器件、制作其的方法和加强其中的管芯的方法。种半导体器件可包括：管芯，所述管芯包括第主面、第二主面和侧面，所述侧面连接第主面和第二主面；至少个传导柱，所述至少个传导柱布置在所述管芯的第主面上并且电耦合到所述管芯；以及绝缘体，所述绝缘体布置在所述管芯的第主面上，所述绝缘体包括上主面和侧面，其中所述至少个传导柱被暴露在所述绝缘体的上主面上，并且其中所述管芯的侧面和所述绝缘体的侧面是共面的。