Image sensor and manufacturing method thereof
The invention provides an image sensor and a manufacturing method thereof. A redistribution effect can be realized without forming a redistribution layer structure on a substrate, so that the method is flexible and easy to operate; and series-parallel connection among a plurality of sensor chips can...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | The invention provides an image sensor and a manufacturing method thereof. A redistribution effect can be realized without forming a redistribution layer structure on a substrate, so that the method is flexible and easy to operate; and series-parallel connection among a plurality of sensor chips can be realized, so that electric connection after package is no longer needed.
本发明提供了种图像传感器及其制造方法,其无需衬底上形成再分布层结构即可实现再分布作用,灵活且易于操作;可以实现多个传感器芯片之间的串并联形式,无需封装后再进行电连接。 |
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