SYSTEM AND METHOD FOR TESTING CHIP-ON-GLASS BONDING QUALITY

A system and method of testing chip-on-glass (COG) bonding quality automatically includes a glass panel comprising two test pads, the test pads electrically interconnected, a display driver comprisingan input node and an output node, and an adhesive layer between the glass panel and the display driver, the adhesive layer binding the glass panel with the display driver, the adhesive layer comprising conductive portions across the adhesive layer between the glass panel and the display driver, wherein the input node, the output node, the two test pads, and the conductive portions are electrically connected to form an electrical testing loop, the electrical testing loop configured to measure a voltage drop across the conductive portions. 种自动测试玻璃上芯片(chip on glass，简称COG)粘接质量的系统和方法包括：玻璃面板，其中包括两个测试垫，所述测试垫互相电连接；显示驱动器，其中包括输入节点和输出节点；位于所述玻璃面板和所述显示驱动器之间的粘合层，其中所述粘合层将所述玻璃面板与所述显示驱动器粘结在起，所述粘合层包括穿过位于所述玻璃面板和所述显示驱动器之间的粘合层的导电部件，其中所述输入节点、输出节点、两个测试垫以及导电部件互相电连接以形成电测试回路，所述电测试回路用于测量穿过所述导电部件的电压降。