BONDING MATERIAL, AND BONDING METHOD AND BONDING STRUCTURE USING SAME

A bonding material which improves impact resistance while improving heat resistance and can bond together objects to be bonded, and a bonding method and bonding structure using said bonding material are provided. This bonding material (10), for bonding two objects to be bonded (14a, 14b), has a firs...

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1. Verfasser:	NOGUCHI MASUMI
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	ALLOYS CHEMISTRY CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING FERROUS OR NON-FERROUS ALLOYS MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR METALLURGY PERFORMING OPERATIONS SOLDERING OR UNSOLDERING TRANSPORTING TREATMENT OF ALLOYS OR NON-FERROUS METALS WELDING WORKING BY LASER BEAM
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Beschreibung
Zusammenfassung:	A bonding material which improves impact resistance while improving heat resistance and can bond together objects to be bonded, and a bonding method and bonding structure using said bonding material are provided. This bonding material (10), for bonding two objects to be bonded (14a, 14b), has a first layer (11), in which the primary component is Sn, and a second layer (12), in which the primary component is a metal having a melting point higher than that of Sn, wherein the first layer (11) and the second layer (12) are stacked and the amount of Sn in the first layer (11) is greater than the stoichiometric amount of Sn that forms an intermetallic compound (15) between the Sn and the metal. 本发明提供种能够提高耐热性的同时提高耐冲击性而对接合对象物进行接合的接合材料、使用其的接合方法以及接合结构。本发明的接合材料是对2个接合对象物(14a、14b)进行接合的接合材料(10)，具备以Sn为主成分的第1层(11)和以具有高于Sn的熔点的金属为主成分的第2层(12)，并且，第1层(11)与第2层(12)层叠，第1层(11)中的Sn的量多于在Sn与金属之间形成金属间化合物(15)的Sn的化学计算量。