Method for preparing a silver-nickel alloy electrical contact by electrolytic deposition

The invention discloses a method for preparing a silver-nickel alloy electrical contact by electrolytic deposition, and belongs to the technical field of electroplating of material surface engineering. The method comprises the following steps of choline chloride and ethylene glycol are heated, stirr...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: TAN YONG, SUN JIE, ZHANG JIULING
Format: Patent
Sprache:chi ; eng
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:The invention discloses a method for preparing a silver-nickel alloy electrical contact by electrolytic deposition, and belongs to the technical field of electroplating of material surface engineering. The method comprises the following steps of choline chloride and ethylene glycol are heated, stirred and mixed, silver nitrate is added until the mixture is completely dissolved, nickel chloride isadded, the solution is continuously heated and stirred until the solution is green and transparent, so that an electroplating solution is obtained; direct current deposition is carried out on a pretreated metal substrate, and the silver-nickel alloy electrical contact is obtained; and in the electrolytic deposition process, the temperature of the electroplating solution is 30-50 DEG C, and the current density is 1-2 A/dm . According to the method for preparing the silver-nickel alloy electrical contact by the electrolytic deposition, the method is a green method for electroplating silver-nickel alloy without cyaniding