Integrated circuit packaging lead framework

The invention discloses an integrated circuit packaging lead framework. The integrated circuit packaging lead framework comprises a chip loading base in a quadrate structure; lead pins are uniformly arranged at the bottom surface of the interior of the chip loading base; a lead pin post is connected...

Ausführliche Beschreibung

Bibliographische Detailangaben

1. Verfasser:	XU CHUANCHENG
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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