Integrated circuit packaging lead framework

The invention discloses an integrated circuit packaging lead framework. The integrated circuit packaging lead framework comprises a chip loading base in a quadrate structure; lead pins are uniformly arranged at the bottom surface of the interior of the chip loading base; a lead pin post is connected to the lead pin in a welding manner; one end of the lead pin post, far away from the lead pin, runsthrough and extends to the outside of the chip loading base; a fixed connecting ring is arranged at the outside of the chip loading base; the upper surface of the fixed connecting ring is connected with a connecting protective cover through the welding manner; the connecting protective cover is provided with a connecting through hole; a device is fixed on a circuit board through the lead pin post, so that the device can be fixed more conveniently; a chip is fixed in the chip loading base through the connecting protective cover, so that the chip is fixed more conveniently; and the integrated circuit packaging lead fra