Laser cutting device

The invention discloses a laser cutting device, and particularly relates to the technical field of lasers. The laser cutting device comprises a laser device and a dust collection mechanism. The dust collection mechanism is fixed to the laser device and comprises a processing box, and the processing...

Ausführliche Beschreibung

Bibliographische Detailangaben

1. Verfasser:	LYU XIANPING
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM
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