Laser cutting device

The invention discloses a laser cutting device, and particularly relates to the technical field of lasers. The laser cutting device comprises a laser device and a dust collection mechanism. The dust collection mechanism is fixed to the laser device and comprises a processing box, and the processing...

Ausführliche Beschreibung

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Bibliographische Detailangaben
1. Verfasser: LYU XIANPING
Format: Patent
Sprache:chi ; eng
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Beschreibung
Zusammenfassung:The invention discloses a laser cutting device, and particularly relates to the technical field of lasers. The laser cutting device comprises a laser device and a dust collection mechanism. The dust collection mechanism is fixed to the laser device and comprises a processing box, and the processing box is fixed to the laser device. A hopper is fixedly arranged inside the processing box. A water tank is arranged at the upper end of the hopper. Water leakage holes are symmetrically formed in the water tank. Air inlet holes are formed in the side wall of the hopper. A first rotary shaft is further arranged in the processing box in a rotational connection manner. A water turbine is arranged on the first rotary shaft. A baffle is rotationally connected with an water inlet of the water turbine.A rotary plate is rotationally connected to the first rotary shaft. Dust collection covers are symmetrically connected with the two sides of the outside of the processing box. A connecting port between each dust collection co