Electronic component module equipped with heat sink and substrate having electronic components mounted thereon, and method for producing same

This electronic component module, which integrally incorporates a plurality of electronic components, is provided with a substrate, a plurality of electronic components mounted on the surface of the substrate, and a heat sink that is formed from a metal and fixed on the substrate. The substrate has a first substrate section, a second substrate section, and a third substrate section. The pluralityof electronic components comprise one or more first components mounted on one surface of the first substrate section, and one or more second components mounted on one surface of the second substrate section. The first and second substrate sections are arranged such that the one surface of the first substrate section and the one surface of the second substrate section face each other. The third substrate section is interposed between the first substrate section and the second substrate section such that the first, third, and second substrate sections are arranged in a row. The heat sink has a fixing part that is fixed