ADHESIVE COMPOSITION INCLUDING POLYAMIDE-IMIDE RESIN

Provided is an adhesive composition which is suitable for laminating a polyimide film to copper foils to produce a double-sided copper-clad laminate for use in producing flexible printed wiring boards. The adhesive composition comprises a polyamide-imide resin, an epoxy resin, and a phosphorus-compo...

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Bibliographische Detailangaben
Hauptverfasser:	YANE TAKEHISA, OHRUI MANABU, EBIHARA SATOSHI, KOYANAGI HIDEYUKI
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY DYES ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL PAINTS PERFORMING OPERATIONS POLISHES PRINTED CIRCUITS TRANSPORTING USE OF MATERIALS AS ADHESIVES
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Beschreibung
Zusammenfassung:	Provided is an adhesive composition which is suitable for laminating a polyimide film to copper foils to produce a double-sided copper-clad laminate for use in producing flexible printed wiring boards. The adhesive composition comprises a polyamide-imide resin, an epoxy resin, and a phosphorus-compound flame retardant, wherein (A) the epoxy resin is contained in an amount of 15-40 parts by mass per 60-85 parts by mass of the polyamide-imide resin, (B) the polyamide-imide resin has a glass transition temperature of 250 DEG C or higher, (C) the polyamide-imide resin has an acid value of 50-150 mg-KOH/g, (D) the epoxy resin is liquid a 25 DEG C, (E) the phosphorus-compound flame retardant is contained in an amount of 15-60 parts by mass per 100 parts by mass of the sum of the polyamide-imideresin and the epoxy resin, and (F) 50 mass% or more of the phosphorus-compound flame retardant is accounted for by a phenanthrene type phosphinic acid derivative. 本申请提供种在用于柔性印刷线路板的双面覆铜层压板中适合用于贴合聚酰亚胺膜与铜箔的粘合剂组合物。种混合有聚酰胺酰亚胺树脂、环氧