ANAEROBICALLY CURABLE COMPOSITIONS

Anaerobically Curable Compositions An anaerobically curable composition comprising an anaerobically curable component that is a combination of a solid resin component and a solid anaerobically curablemonomer. A curing component for curing the anaerobically curable component is included. The composit...

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Hauptverfasser:	BERGIN NIAMH, LOANE MARK, MULLEN DAVID, KNEAFSEY BRENDAN, WROBEL PETER, DOHERTY MICHAEL, O'KANE RUARI, DWORAK DAVID, HOULIHAN JIM, LEDWITH DEIRDRE, FITZPATRICK MARTIN, HYNES AIMEE
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES CHEMISTRY DYES MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FORELSEWHERE METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL PAINTS POLISHES USE OF MATERIALS AS ADHESIVES
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Zusammenfassung:	Anaerobically Curable Compositions An anaerobically curable composition comprising an anaerobically curable component that is a combination of a solid resin component and a solid anaerobically curablemonomer. A curing component for curing the anaerobically curable component is included. The composition is solid and has a melting point in the range from 30 DEG C to 100 DEG C. The composition is dry to touch and can be used to form articles of manufacture such as a tape, an elongate filament, a gasket, a patch. 种可厌氧固化的组合物，其包含可厌氧固化的组分，所述可厌氧固化的组分是固体树脂组分和固体可厌氧固化的单体的组合。包括用于固化所述可厌氧固化的组分的固化组分。所述组合物为固体且具有30℃至100℃范围内的熔点。所述组合物是触干的且可用于形成制品如带、细长长丝、垫片、贴片。