Electroplating method of metal insert in electroacoustic device
The invention discloses an electroplating method of a metal insert in an electroacoustic device. The method comprises the following steps: providing an electroacoustic device blank, wherein the blankcomprises a metal stamping part, a material connecting strip connected with the metal stamping part a...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | The invention discloses an electroplating method of a metal insert in an electroacoustic device. The method comprises the following steps: providing an electroacoustic device blank, wherein the blankcomprises a metal stamping part, a material connecting strip connected with the metal stamping part and extending to the outside of the blank, and the metal insert, and the metal insert comprises an embedding part located at the outside of the blank; electrically connecting one end of the material connecting strip with the embedding part through an electric conduction member; and electroplating the blank through the material connecting strip so as to achieve the electroplating of the metal insert in the electroacoustic device. By adoption of the electroplating method, the secondary electroplating of the metal insert in the electroacoustic device, especially the metal insert injection molded by metal, thereby improving the stability and salt spray resistance of the obtained electroacousticdevice product.
本发明公开了种电声器 |
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