Thermal resistance extraction method and system

The invention discloses a thermal resistance extraction method and system. According to the method and system, infrared thermal imaging measured channel temperature distribution of a device under static power dissipation is acquired, a thermal simulation model of the device is calibrated, and then the thermal resistance of the device is calculated according to the calibrated thermal simulation model. Through the method and system, the advantage of result intuition of an infrared thermal imaging method and the advantages of simplicity and low cost of an ANSYS simulation method are combined, meanwhile, errors brought by the two defects of a low space resolution of the infrared thermal imaging method and a difference between a model and an actual device in ANSYS simulation are solved, and theaccuracy of thermal resistance extraction is greatly improved. 本发明公开种热阻提取方法及系统。所述方法及系统通过获取所述静态功耗下所述器件的红外热成像实测沟道温度分布，对所述器件的热仿真模型进行校准，然后根据所述校准后的热仿真模型进行器件热阻的计算。所述方法及系统结合了红外热成像法结果直观和ANSYS仿真法简易、成本低的优势，同时解决了红外热成像法空间分辨率低和ANSYS仿真中模型