LIGHT-EMITTING DIODE DEVICE AND MANUFACTURING METHOD THEREFOR

LIGHT-EMITTING DIODE DEVICE AND MANUFACTURING METHOD THEREFOR

The invention provides a light-emitting diode device and a manufacturing method therefor. The light-emitting diode device (400) comprises a light-emitting diode chip (430), a packaging colloid (440),and an annular retaining wall (450'). The light-emitting diode chip is provided with a first upp...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: LU TSUNG-LIN, HSIEH CHUNGUAN, YU WEI-TYNG, LIN CHUN-MIN, LIN CHIH-MIN, YEH ROBERT
Format: Patent
Sprache:chi ; eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:The invention provides a light-emitting diode device and a manufacturing method therefor. The light-emitting diode device (400) comprises a light-emitting diode chip (430), a packaging colloid (440),and an annular retaining wall (450'). The light-emitting diode chip is provided with a first upper surface, and the packaging colloid covers the light-emitting diode chip; and a reflection surface (450a) of the annular retaining wall inclines to a side surface (430b) of the light-emitting diode chip. A light-emitting angle can be effectively regulated, and the requirements for redesigning a lens when market demands change can be reduced. 种发光二极管装置及其制作方法，发光二极管装置(400)包括发光二极管芯片(430)、封装胶体(440)以及环形挡墙(450')。发光二极管芯片具有第上表面且封装胶体覆盖发光二极管芯片。其中环形挡墙的反射面(450a)倾斜于发光二极管芯片的侧面(430b)。可有效地调整出光角度，并可减少在面临市场需求改变使重新设计透镜的需求。