SYSTEMS AND METHODS OF TESTING MULTIPLE DIES

In described examples of a method (800) of testing a semiconductor wafer including a scribe line and multiple dies, the method (800) includes implementing a first landing pad on the scribe line (802),and implementing a first interconnect on the scribe line and between the first landing pad and a first cluster of the plurality of dies (804), thereby coupling the first landing pad to the first cluster of dies. The method (800) further includes performing the testing of the first cluster of dies using automated test equipment (ATE) coupled to a probe tip by contacting the first landing pad withthe probe tip and applying an ATE resource to the first cluster of dies (806). 在测试包含划线及多个裸片的半导体晶片的方法(800)的所描述实例中，所述方法(800)包含：在所述划线上实施第着陆垫(802)；及在所述划线上且在所述第着陆垫与所述多个裸片的第集群之间实施第互连件(804)，借此将所述第着陆垫耦合到所述第裸片集群。所述方法(800)进步包含使用耦合到探针尖端的自动化测试设备ATE通过使所述第着陆垫接所述触探针尖端并将ATE资源应用到所述第裸片集群执行所述第裸片集群的测试(806)。