SEMICONDUCTOR MANUFACTURING DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE

The present invention provides a semiconductor manufacturing device capable of reducing stress applied to a bare chip. The semiconductor manufacturing device includes a push-up unit, a collet, and a control device that controls an operation of the push-up unit and the collet. The push-up unit has a block portion that pushes up the bare chip, and a suction portion that is provided on an outer circumference of the block portion and has a suction hole. The block portion has a first block having a square shape in a plan view, a second block having a square shape in a plan view and having a largerplanar area than the first block, and an elongated gap between the first block and the second block, wherein the length direction of the gap extends in a first direction in a plan view and a width direction extends in a second direction. The control device has a mechanism which enables the push-up unit to move in the second direction in the horizontal direction in a state that the first block is pushed up to be higher tha