Electronic component and manufacture thereof

An electronic component and a method for manufacturing the same are provided, wherein the method comprises invisibly cutting along a partition portion in a substrate including a plurality of electronic components and a partition portion disposed between the plurality of electronic components, forming a plurality of invisible cutting paths having different lengths in the partition portion, and separating a plurality of electronic components along the partition portion. 种电子元件及其制法，该制法为于包含有多个电子元件与设于该多个电子元件间的区隔部的基板中沿该区隔部进行隐形切割，以于该区隔部中形成多个长度互不相同的隐形切割路径，再沿该区隔部分离出多个电子元件。