Composition for plating of substrate and plating method using the same

The present invention provides a composition for plating of a substrate and a plating method using the same, the composition for plating of a substrate comprising: an alkylammonium halide and more than one substance selected from a formaldehyde and an EO-PO copolymer. 本发明提供基板镀覆用组合物及利用该组合物的镀覆方法，所述基板镀...

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Bibliographische Detailangaben
Hauptverfasser:	JIN-UK, LEE, HYE-LEE KIM, AE-RIM KIM, EUN-JUNG LIM, HAE-SUNG OH
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	APPARATUS THEREFOR CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROFORMING ELECTROLYTIC OR ELECTROPHORETIC PROCESSES MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY PRINTED CIRCUITS PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS
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Beschreibung
Zusammenfassung:	The present invention provides a composition for plating of a substrate and a plating method using the same, the composition for plating of a substrate comprising: an alkylammonium halide and more than one substance selected from a formaldehyde and an EO-PO copolymer. 本发明提供基板镀覆用组合物及利用该组合物的镀覆方法，所述基板镀覆用组合物包括：烷基铵卤化物；以及从甲醛和环氧乙烷-环氧丙烷共聚物(EO-PO copolymer)中选择的种以上。