Quick-activation process for mechanical zinc plating

Quick-activating process include such technological steps as cleaning, copper base deposition, mixing of materials, regulation of liquid mixture plating zinc, thickening zinc layer and reinforcing plated layer. It features use of a new surfactant to improve quality of plated zinc layer, lower zinc p...

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Bibliographische Detailangaben
Hauptverfasser:	HE MINGYI, JIAO JINGMING, XU YONG
Format:	Patent
Sprache:	eng
Schlagworte:	CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
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Beschreibung
Zusammenfassung:	Quick-activating process include such technological steps as cleaning, copper base deposition, mixing of materials, regulation of liquid mixture plating zinc, thickening zinc layer and reinforcing plated layer. It features use of a new surfactant to improve quality of plated zinc layer, lower zinc powder consumption, speed up deposition and make thickness of plated zinc be controlled easily.