Protective adhesive film applied for preparation of PCB, and preparation method and use method thereof

The invention discloses a protective adhesive film applied for preparation of a PCB, wherein the protective adhesive film includes an upper pasting film layer and a lower pasting film layer; the upperpasting film layer includes a first micro-bonding film and a pure adhesive layer; the lower pasting...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	ZHANG RONGCHEN, HUANG JIE, ZHANG SONGBAI, CHEN JIANJUN, HUANG DAWEI
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES CHEMISTRY DYES METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL PAINTS POLISHES USE OF MATERIALS AS ADHESIVES
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