Protective adhesive film applied for preparation of PCB, and preparation method and use method thereof

The invention discloses a protective adhesive film applied for preparation of a PCB, wherein the protective adhesive film includes an upper pasting film layer and a lower pasting film layer; the upperpasting film layer includes a first micro-bonding film and a pure adhesive layer; the lower pasting...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	ZHANG RONGCHEN, HUANG JIE, ZHANG SONGBAI, CHEN JIANJUN, HUANG DAWEI
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES CHEMISTRY DYES METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL PAINTS POLISHES USE OF MATERIALS AS ADHESIVES
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	The invention discloses a protective adhesive film applied for preparation of a PCB, wherein the protective adhesive film includes an upper pasting film layer and a lower pasting film layer; the upperpasting film layer includes a first micro-bonding film and a pure adhesive layer; the lower pasting film layer includes an adhesive layer, a macromolecular material layer and a second micro-bonding film; the pure adhesive layer is pasted and cladded on the lower surface of the first micro-bonding film; the adhesive layer is pasted and cladded on the lower surface of the pure adhesive layer; the macromolecular material layer is pasted and cladded on the lower surface of the adhesive layer; the second micro-bonding film is pasted and cladded on the lower surface of the macromolecular material layer; two ends of each of the adhesive layer and the macromolecular material layer are shorter than those of the pure adhesive layer. The invention also provides a preparation method of the protectiveadhesive film applied for