Hot melt composition, hot melt composition production method, seal material, electronic device, and lamp

One aspect of the present invention is a hot melt composition that includes a silane coupling agent, a thermoplastic polymer, a softener, and a catalyst. A compound (an elimination compound) generatedby hydrolyzing the silane coupling agent has a boiling point of 70 DEG C -180 DEG C. 本发明的个方面是包含：硅烷偶联...

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Bibliographische Detailangaben
Hauptverfasser:	FUKUDA KATSUHITO, KUROKAWA HIROSHI
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS DYES MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FORELSEWHERE METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL ORGANIC MACROMOLECULAR COMPOUNDS PAINTS POLISHES THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF MATERIALS AS ADHESIVES
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Beschreibung
Zusammenfassung:	One aspect of the present invention is a hot melt composition that includes a silane coupling agent, a thermoplastic polymer, a softener, and a catalyst. A compound (an elimination compound) generatedby hydrolyzing the silane coupling agent has a boiling point of 70 DEG C -180 DEG C. 本发明的个方面是包含：硅烷偶联剂；热塑性聚合物；软化剂；以及催化剂的热熔组合物，其中，所述硅烷偶联剂被水解而发生的化合物(脱离化合物)的沸点为70～180℃的热熔组合物。