Hot melt composition, hot melt composition production method, seal material, electronic device, and lamp

One aspect of the present invention is a hot melt composition that includes: a modified thermoplastic polymer that has an alkoxysilyl group in the molecule thereof; a softener; and a catalyst. 本发明的个方面是包含：在分子内具有烷氧基甲硅烷基的改性热塑性聚合物；软化剂；以及催化剂的热熔组合物。...

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Bibliographische Detailangaben
Hauptverfasser:	FUKUDA KATSUHITO, KUROKAWA HIROSHI
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS DYES MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FORELSEWHERE METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL ORGANIC MACROMOLECULAR COMPOUNDS PAINTS POLISHES THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF MATERIALS AS ADHESIVES
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Beschreibung
Zusammenfassung:	One aspect of the present invention is a hot melt composition that includes: a modified thermoplastic polymer that has an alkoxysilyl group in the molecule thereof; a softener; and a catalyst. 本发明的个方面是包含：在分子内具有烷氧基甲硅烷基的改性热塑性聚合物；软化剂；以及催化剂的热熔组合物。