SOLDER ALLOY FOR DIE BONDING

Provided is a lead-free solder for die bonding, which has high upper temperature limit and improved wettability characteristics. A solder alloy for die bonding, which contains 0.05-3.0% by mass of antimony with the balance made up of bismuth and unavoidable impurities, and a solder alloy for die bon...

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Bibliographische Detailangaben
Hauptverfasser:	ASAGI TAKESHI, WATANABE HIROHIKO, MITANI SUSUMU, SHIMODA MASAYOSHI
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM
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Beschreibung
Zusammenfassung:	Provided is a lead-free solder for die bonding, which has high upper temperature limit and improved wettability characteristics. A solder alloy for die bonding, which contains 0.05-3.0% by mass of antimony with the balance made up of bismuth and unavoidable impurities, and a solder alloy for die bonding, which contains 0.01-2.0% by mass of germanium with the balance made up of bismuth and unavoidable impurities. 提供了用于芯片焊接的无铅焊料，其具有高的耐热温度和改善的润湿性。用于芯片焊接的钎焊合金包含0.05质量％-3.0质量％的锑和由铋及不可避免的杂质组成的其余部分，并且用于芯片焊接的钎焊合金包含0.01质量％-2.0质量％的锗和由铋及不可避免的杂质组成的其余部分。