LED package structure and chip-grade light emitting unit

The invention discloses an LED package structure and a chip-grade light emitting unit. The LED package structure comprises a substrate, an electrode layer and an insulating layer which are arranged onthe substrate and coplanar, a light emitting diode chip which is mounted on the electrode layer, a fluorescent powder plate which wholly packages the top surface of the light emitting diode chip, atleast one light guiding group which is arranged at the light outlet surface of the fluorescent powder plate, and a reflective housing which is arranged on the electrode layer and the insulating layerand packages the sides of the light emitting diode chip and the fluorescent powder plate. The light outlet surface comprises a central region and an annular region which surrounds the central region.The light guiding group comprises a plurality of light guiding microstructures which cover at least 60% area of the annular region, thereby reducing total reflection of blue light of the light emitting diode chip in the annular