Substrate treating apparatus and substrate treating method

Disclosed are a substrate treating apparatus and a substrate treating method. The substrate treating apparatus includes a chamber providing an interior space for treating a substrate, a support unit provided in the chamber and configured to support the substrate, a first ejection unit having a first nozzle configured to supply a first cleaning medium in an aerosol state to the substrate supportedby the support unit, and a second ejection unit having a second nozzle configured to supply a second cleaning medium to the substrate supported by the support unit. 公开了种基板处理装置和基板处理方法。基板处理装置包括：腔室，该腔室为处理基板提供内部空间；支撑单元，该支撑单元设置在腔室中并配置为支撑所述基板；第喷射单元，该第喷射单元具有第喷嘴，该第喷嘴配置为向支撑单元支撑的基板供应处于气溶胶状态的第清洗介质；以及第二喷射单元，该第二喷射单元具有第二喷嘴，该第二喷嘴配置为向支撑单元支撑的基板供应第二清洗介质。