SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

It is an object of the invention to provide a semiconductor device capable of suppressing an increase in manufacturing cost and having good terminal heat dissipation. A semiconductor device(100) includes: a base plate(4); an insulating substrate(2) provided on an upper surface of the base plate; a conductive pattern(1) provided on an upper surface of the insulating substrate; a semiconductor chip(3) mounted on an upper surface of the conductive pattern; a case(5) surrounding the base plate, the insulating substrate, the conductive pattern, and the semiconductor chip; a sealing resin(7) sealingan interior of the case; and an external connection terminal(6) provided to the case. One end portion of the external connection terminal(6) is connected to the conductive pattern(1), the case(5) hasa terminal insertion portion(5c) enabling insertion of the other end portion of the external connection terminal in a peripheral wall portion(5a) thereof, and a portion of the external connection terminal other than the other