PLASMA PROCESSING DEVICE

A plasma processing apparatus including an electrostatic chuck supporting a wafer; a focus ring disposed to surround an outer circumferential surface of the wafer; an insulation ring disposed to surround an outer circumferential surface of the focus ring; and an edge ring supporting lower portions o...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: NOH, YOUNG JIN, IM, JI SOO, LEE, YONG WOO, KIM, KYUNG SUN, SHIM, SEUNG BO, CHOI, WON YOUNG
Format: Patent
Sprache:chi ; eng
Schlagworte:
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