PLASMA PROCESSING DEVICE

A plasma processing apparatus including an electrostatic chuck supporting a wafer; a focus ring disposed to surround an outer circumferential surface of the wafer; an insulation ring disposed to surround an outer circumferential surface of the focus ring; and an edge ring supporting lower portions of the focus ring and the insulation ring, the edge ring being spaced apart from the electrostatic chuck and surrounding an outer circumferential surface of the electrostatic chuck; wherein the edge ring includes a flow channel containing a fluid therein. 种等离子体处理装置包括：支撑晶片的静电卡盘；设置为围绕晶片的外周表面的调节环；设置为围绕调节环的外周表面的绝缘环；以及支撑调节环的下部分和绝缘环的下部分的边缘环，边缘环与静电卡盘间隔开并且围绕静电卡盘的外周表面；其中边缘环包括在其中容纳流体的流道。