Power module and manufacture method thereof

The invention discloses a power module and a manufacture method thereof. The power module includes a chip used for arranging a substrate of a chip and a packaging housing used for packaging the chip and the substrate on a liquid cooling heat dissipation device. The substrate includes a ceramic layer, a front face metalized layer, a back face metalized layer and a pin fin shaped array. The front face metalized layer is arranged on the upper surface of the ceramic layer. The back face metalized layer is arranged on the lower surface of the ceramic layer. The pin fin shaped array is disposed on the lower surface of the ceramic layer. The pin fin shaped array and the ceramic layer are an integrated structure. The substrate is arranged on the upper surface of the liquid cooling heat dissipationdevice through welding or sintering. The invention solves technical problems of large substrate camber control difficulty, low module heat dissipation efficiency, liquid leakage proneness caused by unreliable sealing of a pr