Handheld communication device and thin type heat dissipation structure thereof

The invention relates to a handheld communication device and a thin type heat dissipation structure thereof. The thin type heat dissipation structure comprises a heat conducting plate and a heat pipe,wherein the heat conducting plate comprises a top surface, a bottom surface as well as a penetrating groove penetrating through the top surface and the bottom surface, the inner periphery of the penetrating groove forms an inner annular wall, and the inner annular wall and the bottom surface extend jointly to form opposite bulge pieces; the heat pipe is accommodated in the penetrating groove andclamped by the bulge pieces for positioning, and the heat pipe, the bulge pieces and the bottom surfaces jointly form a flat surface; at least one pair of punching dents is formed in two sides of thepenetrating groove in a punch forming manner and on the top surface of the heat conducting plate, so that two sides of the inner annular wall and the top surface are jointly extruded to deform and form a bulge block, and the he