Modularized replaceable integrated circuit packaging mold and use method

The invention discloses a modularized replaceable integrated circuit packaging mold and a use method. The packaging mold comprises a first module and a second module, wherein the second module surrounds the first module and is arranged on the periphery of the first module, and the top surface of the first module is higher than the second module; the first module corresponds to a cavity area of a packaged body after chip packaging; the second module corresponds to the area except a cavity of the packaged body; the first module is replaceable, and the shape of the first module is complementary with the shape of the corresponding cavity after the chip packaging; by means of replacement of the first module, the first modules with different sizes and shapes can be obtained, and the packaging mold can be applied to a variety of chips; by means of replacement of the second module, the packaging mold can be applicable to chips with different sizes, and packaging cost can be effectively reduced. 本发明公开了种模块化可更换的集成电路封装模具