3D staggered floor stacked packaging structure for bulk memory circuit

The invention discloses a 3D staggered floor stacked packaging structure for a bulk memory circuit, and belongs to the technical field of electronic product packaging. The structure comprises memory chips, an adhesive, bonding wires, a substrate, and a housing. The structure is provided with a plura...

Ausführliche Beschreibung

Bibliographische Detailangaben

1. Verfasser:	ZHAO HERAN
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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