Laser processing device

The invention discloses a laser processing device. The device comprises a machine base, a support and a supporting table are arranged on the machine base, a controller and an air cylinder are arrangedon the support, a linkage frame is connected to the air cylinder, a laser processing head is arrange...

Ausführliche Beschreibung

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Bibliographische Detailangaben
1. Verfasser:	LYU XIANPING
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM
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Beschreibung
Zusammenfassung:	The invention discloses a laser processing device. The device comprises a machine base, a support and a supporting table are arranged on the machine base, a controller and an air cylinder are arrangedon the support, a linkage frame is connected to the air cylinder, a laser processing head is arranged on the linkage frame in a swing manner, a buffer mechanism is arranged on the linkage frame, an arc block is in sliding connection to the linkage frame, a through hole is formed in the middle of the arc block, side holes are formed in the two sides of the arc block, push rods are hinged to the two sides of the linkage frame, rocker arms are symmetrically hinged to the through hole, first springs are arranged between the rocker arms and the through hole, limiting holes are formed in the two ends of the arc block, metal balls are arranged in the limiting holes, and are connected with a cooler, an opening is formed in each metal ball, a rubber sleeve is arranged on each opening, limiting rods are hinged to the two s